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Time, Temperature and Humidity Stress of Final Board Finish Solderability
1 PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance.
2 INTRODUCTION
The IPC 5-23d - Alternate Final Board Finishes Task Group is organized under the IPC Assembly and Joining Committee. Alternate Final Board Finishes Task Group activity began in the mid 1990s under IPC 5-23 Solderability Subcommittee. Surface mount technology was rapidly replacing through-hole construction. Planar surfaces, better than reflowed solder or hot-air-solder-level (HASL), were required. Originally, IPC standards for solderability testing were written around tin/lead surfaces only. It was proposed by committee participants that a whole new standard would be needed for testing the solderability of these new final board finishes.
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