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Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
1.0 SCOPE
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
1.1 Purpose
The purpose of this document is to provide a standardized thermal cycling characterization method and reporting procedure of surface mount solder attachment for use in the study of processes and parameters, and for analytical prediction of solder joint reliability.
1.2 Definition of Terms
The definition of all terms used herein shall be as specified in IPC-T-50, except as otherwise specified in Section 3.
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