Standards Manage Your Business
We Manage Your Standards
Standards Manage Your Business
We Manage Your Standards
Test Methods for Characterization of Printed Board Assembly Pad Cratering
1 SCOPE
This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods can be used to rank order and compare different printed board materials and design parameters, but do not define acceptance criteria.
1.1 Performance Classification
This test method guideline recognizes that surface mount assemblies (SMAs) will be subject to variations in performance requirements based on end use. While performance classes are defined in IPC-6011, these performance classifications are not specific as to the required reliability. As of the publication of this standard, the acceptance criteria needs to be established as agreed between user and supplier (AABUS).
Currently Viewing
Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!
© Copyright 2025 BSB Edge Private Limited.
