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Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
1 SCOPE
This guideline document establishes an Acoustic Emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronic assemblies during mechanical loading. Mechanical loading may include stressors such as fourpoint bend test, spherical bend test, or back-end manufacturing steps post surface mount attachment. The initial focus for this test method is to identify the printed board pad cratering mechanism and printed board material performance. This approach may eventually be extended to examine other failure modes depending on the guideline’s evolution and adoption, as this methodology remains in development.
1.1 Purpose The purpose of this document includes:
• Identification of failure initiation time: this period may precede electrical detection of failures such as pad cratering damage during a mechanical stress test.
• Identification of the failure initiation location through detection of AE signals generated due to stress-induced physical damage.
• Estimation of the strain at which the acoustic failure event is observed, which can be utilized as a design guideline.
• Provision of standardized test guidelines and reporting procedures.
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