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Surface Mount Council White Paper - Chip Mounting Technology (CMT)
ABSTRACT
This Chip Mounting Technology (CMT) white paper is a status of the technology on various methodologies for mounting and interconnecting bare (unpackaged) active devices to various substrate materials. A review will be conducted of the currently available mounting techniques for Tape Automated Bonding, Wire Bonding, and Flip Chip, followed by an examination of the most commonly used substrate options of laminate, ceramic, and silicon. This paper, which represents the position of the Surface Mount council, is being presented to describe the emerging integrated circuit chip mounting techniques that are emerging on the technology time horizon.
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