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Stencil Design Guidelines
1 PURPOSE
This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established.
1.1 Terms and Definitions
All terms and definitions used throughout this handbook are in accordance with IPC-T-50. Definitions noted with an asterisk (*) are quoted from IPC-T-50. Other specific terms and definitions, essential for the discussion of the subject, are provided below.
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