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Stencil and Misprinted Board Cleaning Handbook
1.0 SCOPE
1.1 Statement of Scope
This handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.
1.2 Purpose
The goal in stencil printing is to place an exact amount of material in a precise location on the PCB. The print medium might be solder paste, adhesive/glue, flux, or thick film materials. The squeegee speed or pressure can affect the quality of the material deposition, the stencil is the primary control mechanism for material deposition. The purpose of this handbook is to provide the assembler best practice guidelines for understencil cleanliness during the stencil printing process, and stencil cleaning once the stencil is removed from the stencil printer. The document also addresses best practices for cleaning a PCB that was misprinted.
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