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Standards Manage Your Business
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Standard for Printed Board Handling and Storage
1 SCOPE
Historically, the printed board industry has relied on military specifications and guidelines to define packaging methods to preserve the quality and reliability of printed boards during shipment and storage. However, many of these documents are obsolete, incomplete, do not address Pb-free assembly processes or do not cover newer laminates or final finishes.
1.1 Purpose
This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions and storage for printed boards. The requirements and recommendations are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge (ESD) (when necessary) and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for Pb-free soldering.
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