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IPC

IPC-HM-860 : 1987

Specification for Multilayer Hybrid Circuits

Standard Details

1.0 SCOPE

1.1 Scope

This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may include passive elements.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-HM-860 : 1987
Document Year: 1987

Life Cycle

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ACTIVE
IPC-HM-860 : 1987
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