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Specification for Immersion Tin Plating for Printed Circuit Boards - Amendment 1
3.5 Solderability This thickness specification contained herein shall meet the coating durability requirements of Category 3 in IPC/EIA J-STD-003, i.e., intended for boards likely to experience long storage (e.g. greater than six months). Caution needs to be exercised pertaining to the storage and packing of the ISn boards to ensure that the growth of copper-tin IMC’s and surface oxides are minimized and will thus meet the Category 3 requirements. Exposure to high storage temperatures will accelerate the formation rate of copper tin intermetallics. Storage in a high humidity environment with the PCBs removed from their original packaging may increase the oxide thickness and/or species and likewise have a detrimental effect on solderability. Recommended storage conditions should not exceed 25°C [77.0 oF] and a humidity range of 30 to 70% R.H. Such storage conditions are stated in J-STD-003 as providing a one year coating durability for Class 3 applications.
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