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Specification for Immersion Silver Plating for Printed Circuit Boards
1 SCOPE
1.1 Statement of Scope
This specification sets the requirements for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. This specification is intended to set requirements for IAg deposit thickness based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).
1.2 Description
IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering, press fit connections and as a contact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement.
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