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    IPC

    IPC/JPCA-4104 : 1999

    Specification for High Density Interconnect (HDI) and Microvia Materials

    Standard Details

    IPC-4104 was developed with consideration to High Density Interconnect (HDI) layers that use modified ‘‘conventional’’ plated-through hole (PTH) processes and chemistries. The industry does not yet have enough experience to develop specification standards for materials used to make HDI layers. The added layers are formed by novel processes that are drastically different from ‘‘conventional’’ PTH constructions (i.e., non-plated copper processes). As experiences are gathered, additional specifications may be added. In the meantime, the customer and manufacturer should work together to set the criteria for acceptance of product using the new technologies.

    General Information

    Status : ACTIVE
    Standard Type: Main
    Document No: IPC/JPCA-4104 : 1999
    Document Year: 1999
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    IPC/JPCA-4104 : 1999
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