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Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards - Amendment 1
Foreword:
IPC-4821 was based on industry knowledge at the time of its original release in March 2006. Embedded passive devices may be made with a large variety of materials and cover a wide range of fabrication processes. In March of 2006, use of these materials was not widespread. As such, it was recognized that updates to this document would be needed and this Amendment 1 is the first such update. It is recommended that the customer and supplier continue to work together to set the criteria for acceptance of embedded passive material products.
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