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Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards - Amendments 1 & 2
1 SCOPE
1.1 Scope
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).
1.2 Description
ENIG is an electroless nickel layer capped with a thin layer of immersion gold. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface. The immersion gold protects the underlying nickel from oxidation/passivation over its intended life. However, this layer is not totally impervious and it will not pass the requirements of a ‘classic’ porosity test.
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