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Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
1 SCOPE
1.1 Statement of Scope
This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This specification sets requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
1.2 Description
ENEPIG is a tertiary layered surface finish plated over copper as the basis metal. ENEPIG consists of an electroless nickel base layer over which is plated an electroless palladium barrier layer followed by a deposit of a thin immersion gold as the final outer layer. For deposition process details, see APPENDIX 1 of this specification. It is a multifunctional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the mating surface for soft membrane and steel dome contacts. Additional applications include use in Low Insertion Force (LIF) and Zero Insertion Force (ZIF) edge connectors and for press-fit applications. The electroless palladium layer forms a diffusion barrier that impedes nickel diffusion to the gold surface. The immersion gold protects the palladium layer from reacting with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering.
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