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Specification for Base Materials for Rigid and Multilayer Printed Boards
1 SCOPE
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
1.1 Classification
The system shown below identifies clad and unclad laminate or prepreg base materials. The specification sheets serve as a cross-reference connecting the outlined callout system in this document to previously used systems.
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