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Specification for Base Materials for Rigid and Multilayer Printed Boards - Amendment 1
1 SCOPE
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
1.1 Classification The system shown below identifies clad and unclad laminate or prepreg base materials. The specification sheets serve as a cross-reference connecting the outlined callout system in this document to previously used systems.
Example for laminate base materials where this specification is referenced:
L Material Designator (see 1.1.1)
25 Specification Sheet Number (see 1.1.1)
1500 Nominal Laminate Thickness (see 1.1.2)
C1/C1 Metal Cladding Type and Nominal Weight/Thickness (see 1.1.3)
A Thickness Tolerance Class (see 1.1.4)
A Surface Quality Class (see 1.1.5)
Example for prepreg base materials where this specification is referenced:
P Material Designator (see 1.1.1)
25 Specification Sheet Number (see 1.1.1)
E7628 Reinforcement Style (see 1.1.6)
TW Resin Content Method (see 1.1.7)
RE Flow Parameter Method (see 1.1.7)
VC Optional Prepreg Method (see 1.1.7)
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