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Specification for Base Materials for High Speed/High Frequency Applications - Amendment 1
1 GENERAL
1.1 Scope
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.
1.2 Type Designation
The following system identifies clad and unclad plastic laminate and bonding layer materials for conventional and enhanced part number call out. Conventional laminate part numbers reflect traditional specification values, and are consistent with the callouts in Table 1-1. Enhanced laminate part numbering would include the conventional part number in Table 1-1 as well as the enhanced information in Table 1-2. Bonding layer part numbers are covered in Table 1-3.
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