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IPC

IPC-S-816 : 1993

SMT Process Guideline and Checklist

Standard Details

1.0 SCOPE

This document is intended to provide guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface mounting attachment of components. Each section contains a list of problems often observed during a specific part of the surface mount assembly process. The list of observed symptoms is matched by a description of causes often associated with the symptoms. Suggestions for correction are also included. These solutions may be related to the equipment, materials, or design. Accordingly, some of these corrective measures cannot be implemented on the shop floor.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-S-816 : 1993
Document Year: 1993

Life Cycle

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IPC-S-816 : 1993
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