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Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
1.0 SCOPE
This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.
1.1 Purpose
The purpose of this standard is to establish design principles and recommendations that shall be used to produce the appropriate class of multichip module or assembly. Unique design requirements for multichip modules and multichip module assemblies intended for military electronic equipment applications will be noted as such, and shall be fabricated by a supplier that has been qualified by the appropriate agency unless otherwise agreed to contractually.
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