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Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes in Printed Wiring Boards
Objective
The ‘‘Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes (PTH) in Printed Wiring Boards’’ had the following objectives:
• Evaluate the performance of small diameter PTHs under controlled environmental conditions.
• Evaluate the influence of the thickness and quality of deposited copper on PTH performance.
• Determine the impact of varying PTH aspect ratios.
• Collect data on the influence of product design or manufacturing methods.
• Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.
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