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Rework, Modification and Repair of Electronic Assemblies
1 General
1.1 Scope
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria.
This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.
1.2 Purpose
This document prescribes the procedural requirements, tools, materials and methods to be used in the modification, rework, repair, overhaul or restoration of electronic products. Although this document is based in large part on the Product Class definitions used in IPC documents such as J-STD-001 or IPC-A-610, this document should be considered applicable to any type of electronic equipment. When invoked by contract as the controlling document for the modification, rework, repair, overhaul or restoration of products, the requirements flowdown apply.
IPC has identified the most common equipment and process in order to make a specific repair or rework. It is possible that alternate equipment and processes can be used to make the same repair. If alternate equipment is used, it is up to the user to determine that the resultant assembly is good and undamaged.
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