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IPC-4563 : 2007

Resin Coated Copper Foil for Printed Boards Guideline

Standard Details

1 SCOPE

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-4563 : 2007
Document Year: 2007

Life Cycle

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ACTIVE
IPC-4563 : 2007
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