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Requirements for Soldering Fluxes
1 SCOPE
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes.
1.1 Purpose
The purpose of this standard is to classify and characterize Sn/Pb and Pb-free soldering flux materials for use in electronic metallurgical interconnections for printed board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder wires and preforms. The fluxes involved relate to all aspects of application, such as: printed board fabrication, lead tinning, wave soldering, reflow and rework. Fluxes covered by this standard are intended for use in various applications in industry. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection.
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