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IPC-J-STD-005 - Revision B : 2004

Requirements for Solder Pastes

Standard Details

1 GENERAL

1.1 Scope

This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of requirements information and options that should be addressed when procuring solder paste.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-J-STD-005 - Revision B : 2004
Document Year: 2004

Life Cycle

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ACTIVE
IPC-J-STD-005 - Revision B : 2004
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