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IPC-J-STD-006 - Revision C : 2013

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Standard Details

1 PREFACE

1.1 Scope

This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for ‘‘special form’’ (see 1.2.3) electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.

This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are:

J-STD-004 Requirements for Soldering Fluxes

J-STD-005 Requirements for Soldering Pastes

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-J-STD-006 - Revision C : 2013
Document Year: 2013

Life Cycle

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IPC-J-STD-006 - Revision C : 2013
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