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Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Separations
OBJECTIVE
The objective of this round robin was to provide the industry with a test method that removes the subjectivity of microsection evaluation after Thermal Stress exposure for detecting the presence of inner-layer separations in plated-through holes and gives greater reproducibility than current optical evaluations.
The purpose of this test program is to determine the ability of Interconnect Stress Testing (IST) to induce and measure inner-layer separation and to correlate IST with Thermal Stress/microsection testing. The two specific test methods used were IPC-TM-650, Methods 2.6.26 - DC Current Induced Thermal Cycling Test, and 2.6.8 - Thermal Stress of Plated- Through Holes.
The goal was to assess IST use as a test for incoming inspection in lieu of Thermal Stress.
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