
Reflow Oven Process Control Standard
1 SCOPE
This standard provides requirements for process control of conveyorized solder reflow ovens. It includes a methodology for performing temperature measurements over time to establish a baseline profile, and then provides requirements to verify repeatability through periodic verification of the oven profile.
This standard is not intended for the assembly product profile/recipe. For detailed information on development or veri.cation of a product pro.le/recipe, see IPC-7530.
This standard does not address vapor phase processes. Batch ovens offer lower throughput and are also not covered in this standard.
1.1 Purpose
This standard provides baseline performance, periodic verification and performance repeatability requirements for reflow oven equipment.
1.2 Measurement Units
This standard uses International System of Units (SI) units [Imperial English equivalent units are in brackets for convenience]. The SI units used in this standard are Celsius (°C) [°F] for temperature and temperature tolerances.
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