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Reflow Oven Process Control Standard
1 GENERAL
1.1 Scope
This standard provides process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard methodology. Equipment calibration and maintenance guidelines are provided.
This standard is intended to verify the operating parameters of the reflow oven. This standard is not intended for the assembly product profile/recipe. For detailed information on development or verification of a product profile/recipe see IPC- 7530.
This standard does not provide guidance for vapor phase processes.
1.2 Purpose
Intended for users of reflow equipment to baseline performance and periodically verify and demonstrate acceptable oven performance repeatability.
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