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Qualification and Performance Specification for Printed Electronics on Rigid Substrates
1 SCOPE
This standard establishes and de.nes the quali.cation and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive or nonconductive.
1.1 Purpose
The purpose of this speci.cation is to provide requirements for quali.cation and performance of rigid printed electronics designed to IPC-2294.
1.2 Classification
IPC standards recognize that electrical and electronic assemblies are subject to classi.cations by intended end-item use. Three general end-product classes have been established to reflect differences in manufacturability, complexity, functional performance requirements, and veri.cation (inspection/test) frequency. It should be recognized that there may be overlaps of equipment between classes.
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