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Printed Board Handling and Storage Guidelines
1 INTRODUCTION
1.1 Background
Historically, the printed board industry has relied on military specifications and guidelines to define packaging methods to preserve the quality and reliability of printed boards during shipment and storage. However, many of these documents are obsolete, incomplete, do not address Pb-free assembly processes, or do not cover newer laminates or final finishes.
1.2 Scope
This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge (ESD) (when necessary), and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for Pb-free soldering.
This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering. As a guideline, this information is to be used with, and is secondary to, established requirements in such documents as the IPC-4550 series for final finishes.
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