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IPC-FC-234 - Revision A : 2014

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

Standard Details

1 INTRODUCTION

This document is intended to provide the designer/user with information related to the use of pressure sensitive adhesives (PSAs) for assembly of flexible printed boards and membrane switches. This guide provides information on adhesive types available and processes suggested for their proper use, highlights strengths, weaknesses, or limitations, how to start implementation and where to find additional information.

1.1 Scope

This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component attachments (see Figures A1 and A13). In addition, the guideline describes the type of materials and processes that may be used to accomplish proper assemblies.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-FC-234 - Revision A : 2014
Document Year: 2014

Life Cycle

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ACTIVE
IPC-FC-234 - Revision A : 2014
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