logo

Standards Manage Your Business

We Manage Your Standards

IPC

IPC/EIA-J-STD-032 : 2002

Performance Standard for Ball Grid Array Balls

Standard Details

1 SCOPE

This standard establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. All BGA terminals shall meet the designated standards detailed in this document and includes such diverse terminations as solder balls. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.

1.1 Purpose

The purpose of this document is to establish for the manufacturer and user of ball grid array devices, a set of designations and expectations for product performance. Included in the product performance will be the flexibility to implement the best commercial practices.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC/EIA-J-STD-032 : 2002
Document Year: 2002

Life Cycle

Currently Viewing

ACTIVE
IPC/EIA-J-STD-032 : 2002
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2025 BSB Edge Private Limited.

Enquire now +