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Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
1.0 SCOPE
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
1.1 Purpose
This standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010 family (IPC-6011, IPC-6012 and IPC-6013) of standards. The OSP deposit specified by using this document will meet the highest coating durability rating for OSP as specified in the J-STD-003 printed board solderability specification.
This specification is based on three critical factors:
1.1.1 The OSP coating process is in control producing a normal distribution for organic film coating thicknesses.
1.1.2 That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
1.1.3 That the OSP process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined herein.
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