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Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
1 SCOPE
1.1 Introduction
This document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model. The intent of this document is to help educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
FEA has been used in the microelectronics industry for several decades. Numerical models offer several advantages in the design of microelectronics devices. If used correctly, they can provide guidance on:
1. Potential tradeoffs to be made in achieving the optimal design of microelectronic devices.
2. Performance and reliability of microelectronics devices will be evaluated by including the impact of multiple design, material, geometry, and process parameters.
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