Standards Manage Your Business
We Manage Your Standards
Standards Manage Your Business
We Manage Your Standards
Monotonic Bend Characterization of Board-Level Interconnects - Amendment 1
1 FOREWORD
This publication on monotonic bend testing is intended to characterize the fracture strength of a component’s board-level interconnects. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies. The monotonic bend characterization results provide a measure of fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations, and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation.
2 INTRODUCTION
Semiconductor devices are assembled in a variety of package configurations, and are used in a multitude of applications. Given the diversity of package constructions and end-use conditions, it is not feasible to establish a single qualification requirement relating to bend testing; however, definition of a uniform test methodology and a standard reliability characterization reporting process are increasingly necessary to ensure adequate product quality.
3 SCOPE
This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.
Currently Viewing
Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!
© Copyright 2025 BSB Edge Private Limited.
