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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
1 PURPOSE
The purpose of this standard is to identify the classification level of nonhermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
This standard may be used to determine what classification level should be used for Surface Mount Device (SMD) package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability. MSL (moisture sensitivity level) ratings generated by this document are utilized to determine the soak conditions for preconditioning as per JESD22-A113.
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