IPC/JEDEC-J-STD-020 - Revision F : 2022

1 Purpose

The purpose of this standard is to identify the classification level of non-hermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. This standard may be used to determine what classification level should be used for non-hermetic SMD qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of longterm reliability. The Moisture Sensitivity Levels (MSLs) rating generated for an SMD by this document is utilized to determine the soak conditions for preconditioning as per JESD22-A113 and how the SMD can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations as per J-STD-033. For IC devices that may be process sensitive, please refer to J-STD-075 to determine if a PSL (Process Sensitivity Level) classification is required.

2 Scope

This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated devices and other devices made with moisture-permeable materials designed for surface mount assemblies. The MSL classification levels are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their SMDs, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD, this method may be used for reclassification according to 4.3.