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Moisture Sensitivity Classification for Non-IC Components
1 GENERAL
1.1 Scope
The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.
This standard may be used to determine what classification level should be used for initial reliability qualification.
If an initial qualification exists and no major changes have been made, this method may be used for reclassification to an improved level (longer floor life up to level 2). The reclassification level cannot be improved by more than one level without additional reliability testing.
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