Standards Manage Your Business
We Manage Your Standards
Standards Manage Your Business
We Manage Your Standards
Mechanical Shock Test Guidelines for Solder Joint Reliability
INTRODUCTION
With the growth of electronics and the increased accessibility and portability, drop shock and other mechanical impacts are increasingly a concern. This document attempts to improve upon past mechanical shock test methods, and tie test conditions back to the use-conditions. A method is proposed such that regardless of what level (system, board assembly, simplified single component board testing, etc.) testing is conducted, there should be a correlation back to the use-condition. In order to fulfill this goal, additional metrologies are introduced to aid in these correlations.
Following the requisite introductory sections, the concept of use-conditions is introduced and suggestions are made on how use-condition data may be acquired and applied. Next, the testing methods for fully assembled systems are introduced. Options for test conditions are discussed and the data that should be collected is outlined.
Currently Viewing
Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!
© Copyright 2025 BSB Edge Private Limited.
