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Mechanical Outline Standard for Flip Chip and Chip Size Configurations
1 SCOPE
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
1.1 Purpose
The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard.
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