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Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly
1.0 SCOPE/INTRODUCTION
This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
It uses test vehicles that are intended to be representative of the electronic circuits that are in production. It is a test yielding both quantitative and qualitative data.
This test may be used for Process Qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to electrochemical risk. Changes may involve any assembly process step, or a change in the printed board supplier, solder mask or metallization, soldering material supplier, conformal coating, etc. The test vehicle construction will vary depending upon the type of change being evaluated.
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