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Implementation of Flip Chip and Chip Scale Technology
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This document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect (HDI), Micro Ball Grid Array (ìBGA), Micro Surface Mount Technology (MSMT) and Slightly Larger than Integrated Circuit Carrier (SLICC).
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