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Implementation of Ball Grid Array and Other High-Density Technology
1 SCOPE
This document establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/ high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments. The focus of the document is on design through testing issues related to Ball Grid Array and other high performance packages including fine pitch, ultra fine pitch and thru-hole PGA.
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