Standards Manage Your Business
We Manage Your Standards
Standards Manage Your Business
We Manage Your Standards
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
1 FOREWORD
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage such as ‘‘cracks and delamination’’ from the solder reflow process. This document describes the standardized levels of floor-life exposure for moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/ reflow related failures. Companion documents J-STD-020, J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively.
For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 °C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material interface degradation can result in cracking and/or delamination of critical interfaces within the device.
Currently Viewing
Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!
© Copyright 2025 BSB Edge Private Limited.
