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Handbook on Adhesive Bonding in Electronic Assembly Operations
1 SCOPE
For the purpose of the initial version of this document, the discussion of adhesives will be limited to liquid, paste and gel materials and closely related film adhesives, which require some form of ‘‘cure’’ mechanism to achieve their full performance. Materials that rely primarily on pressure-sensitive bonds, whether coated on an inert film or not (generically ‘‘tapes’’) will not be addressed at this time. Similarly, though there is much overlap in material chemistry and application, the subcommittee has chosen to defer the discussion of underfill materials at present. Underfill materials are discussed in J-STD-030. Surface mount adhesives are also not addressed in this document. Surface mount adhesives are discussed in IPC-SM-817.
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