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Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
1 INTRODUCTION
1.1 Scope
This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave).
1.2 Background
During mass soldering, it is important that all solder joints reach the minimum soldering temperature. The minimum soldering temperature is the minimum temperature necessary to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces and the formation of a layer(s) of intermetallic compound(s) of some of the base metal(s) with one or more constituents of the solder alloy. As a practical matter, the minimum soldering temperature is somewhat (~25°C) above the melting temperature (Liquidus temperature) of the solder alloy. The solder joint on a given assembly that reaches the minimum soldering temperature last (typically on or underneath one of the most massive components) has to be the one that determines the temperature profile setting for a given assembly and a given soldering process/machine.
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