Standards Manage Your Business
We Manage Your Standards
Standards Manage Your Business
We Manage Your Standards
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
1 SCOPE
This document describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.
Thermal profile is a unique temperature vs. time plot for each fully populated printed board assembly, using thermocouples attached to selected representative components of the printed board assembly as it travels at a given belt speed (i.e., transport speed) through various temperature zones of an oven or soldering system.
1.1 Purpose
The purpose of this document is to provide useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This document is for managers, design and process engineers and technicians who deal with mass soldering processes.
Currently Viewing
Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!
© Copyright 2025 BSB Edge Private Limited.
