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IPC-CM-770 - Revision E : 2004

Guidelines for Printed Board Component Mounting

Standard Details

1 SCOPE

This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, techniques of general interest for assembly (both manual and machines) and discusses considerations of, and impacts upon, subsequent soldering, cleaning, and coating processes. The information herein consists of compiled data representing commercial and industrial applications.

This section discusses general recommended assembly guidelines. Later sections discuss information concerning specific packaging types.

Sections 2 through 5 provide guidelines for the specific component within each sectional document. The parts are described in detail and each section outlines specifics affecting the part class. The descriptions and classifications provided are those generally used in the industry with reference to military and commercial applications.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-CM-770 - Revision E : 2004
Document Year: 2004

Life Cycle

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ACTIVE
IPC-CM-770 - Revision E : 2004
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