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Guidelines for Multichip Module Technology Utilization
1.0 INTRODUCTION
Electronic packaging continues to focus on the ever increasing need for higher electrical speed and higher interconnection density. In existing packaging concepts using printed board assemblies and individually packaged integrated circuits, performance may be sacrificed because of the signal path length needed to interconnect the semiconductors contained in the various packages. In contrast to the above, improvements in speed, reliability, and density accompany the use of unpackaged integrated circuit chips on fine line interconnection substrates. A functional, packaged module exhibiting these attributes will be called a ‘‘Multichip Module’’ (MCM), and is the subject of this document. A variety of materials and techniques may be employed in creating an MCM. In section 2.0, various approaches are categorized, and the reader is led through a decision-making process to assist in the selection of the proper MCM technology for a given set of technical requirements. Later sections provide detailed information regarding each technology type.
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